Customization: | Available |
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Application: | Server |
Type: | Vapor Chamber |
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Introducing the Copper Vapor Chamber Cooling Fin Assembly by Huizhou Jindu Technology Co.,Ltd. This innovative product combines a vapor chamber heat exchanger with a zipper fin cooler for efficient cooling performance.
Material: | AL or Cu |
Size: | According to 2D, 3D drawing |
Finish | Black anodizing, Clear anodization,Painting,E-coating, Nickel plating,etc |
Lead Time | Normally 7-24 working days |
Main process | Heatpipe manufacturing,CNC, Stamping,Soldering/pressing,Surface Treatment, Assembly, Inspection, Package, etc |
Certificates &Standard | ISO9001, IATF16949, ROHS |
Huizhou Jindu Technology Co.,Ltd. offers Copper Vapor Chamber Cooling Fin Assembly for various applications like Networking/Optical, Industry, Medical, New energy/Storage, AI/Server, and LED, etc.
When it comes to packaging our heatsinks at Huizhou Jindu Technology Co.,Ltd., we take into consideration the product volume, size, and most importantly, the requirements of our clients.
Typically, we use cartons to pack all the parts securely. However, for larger orders, we may opt to use a wooden case to pack several cartons together for added protection during transit.